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  1. Taschenbuch
    Sofort lieferbar
    Electrothermal Analysis of VLSI Systems addresseselectrothermal problems in modern VLSI systems. Part I, The Building Blocks, discusses electrothermal phenomena andthe fundamenta...
    125,28 €
    Alle Preise inkl. MwSt | Versandkostenfrei
  2. Ebook
    Sofort lieferbar
    Electrical overstress (EOS) and Electrostatic discharge (ESD) pose one of the most dominant threats to integrated circuits (ICs). These reliability concerns are becoming more serious with the downw...
    149,79 €
    Alle Preise inkl. MwSt
  3. Ebook
    Sofort lieferbar
    As the complexity and the density of VLSI chips increase with shrinking design rules, the evaluation of long-term reliability of MOS VLSI circuits is becoming an important problem. The assessment a...
    213,99 €
    Alle Preise inkl. MwSt
  4. Ebook
    Sofort lieferbar
    Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material co...
    149,79 €
    Alle Preise inkl. MwSt
  5. Ebook
    Sofort lieferbar
    Moore's law [Noy77], which predicted that the number of devices in­ tegrated on a chip would be doubled every two years, was accurate for a number of years. Only recently has the level of integrati...
    149,79 €
    Alle Preise inkl. MwSt
  6. Ebook
    Sofort lieferbar
    List of Figures. List of Tables. Preface. Acknowledgments.Part I: The Building Blocks. 1. Introduction.2. Power Analysis for ...
    96,29 €
    Alle Preise inkl. MwSt
  7. Buch
    Bezug 11-15
    As the complexity and the density of VLSI chips increase with shrinking design rules, the evaluation of long-term reliability of MOS VLSI circuits is becoming an important problem. The assessment a...
    242,98 €
    Alle Preise inkl. MwSt | Versandkostenfrei
  8. Buch
    Bezug 11-15
    Electrothermal Analysis of VLSI Systems addresseselectrothermal problems in modern VLSI systems. Part I, The Building Blocks, discusses electrothermal phenomena andthe fundamenta...
    125,28 €
    Alle Preise inkl. MwSt | Versandkostenfrei
  9. Buch
    Bezug 11-15
    Moore's law [Noy77], which predicted that the number of devices in tegrated on a chip would be doubled every two years, was accurate for a number of years. Only recently has the level of integratio...
    184,13 €
    Alle Preise inkl. MwSt | Versandkostenfrei
  10. Buch
    Bezug 11-15
    Physical Design for Multichip Modules collects togethera large body of important research work that has been conducted inrecent years in the area of Multichip Module (MCM) design. The ...
    184,13 €
    Alle Preise inkl. MwSt | Versandkostenfrei
  11. Buch
    Bezug 11-15
    Electrical overstress (EOS) and Electrostatic discharge (ESD)pose one of the most dominant threats to integrated circuits (ICs).These reliability concerns are becoming more serious with the dow...
    184,13 €
    Alle Preise inkl. MwSt | Versandkostenfrei
  12. Taschenbuch
    Bezug 11-15
    Moore's law [Noy77], which predicted that the number of devices in tegrated on a chip would be doubled every two years, was accurate for a number of years. Only recently has the level of integratio...
    184,13 €
    Alle Preise inkl. MwSt | Versandkostenfrei
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