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  1. Ebook
    Sofort lieferbar
    TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technol...
    220,00 €
    Alle Preise inkl. MwSt
  2. Taschenbuch
    Bezug 11-15
    TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpo...
    249,59 €
    Alle Preise inkl. MwSt | Versandkostenfrei
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