ibrahim abe m elfadel

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  1. 3D Stacked Chips
    3D Stacked Chips
    Ibrahim (Abe) M. Elfadel
    Springer International Publishing
    Ebook
    Sofort lieferbar
    .Describes techniques for monitoring and mitigating thermal behavior in 3D ICs;
    53,49 €
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  2. The IoT Physical Layer
    The IoT Physical Layer
    Ibrahim (Abe) M. Elfadel
    Springer International Publishing
    Ebook
    Sofort lieferbar
    This book documents some of the most recent advances on the physical layer of the Internet of Things (IoT), including sensors, circuits, and systems. The application area selected for illustrating ...
    96,29 €
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  3. Machine Learning in VLSI Computer-Aided Design
    Machine Learning in VLSI Computer-Aided Design
    Ibrahim (Abe) M. Elfadel
    Springer Nature Switzerland
    Ebook
    Sofort lieferbar
    This book provides readers with an up-to-date account of the use of machine learning frameworks, methodologies, algorithms and techniques in the context of computer-aided design (CAD) for very-larg...
    203,29 €
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  4. VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
    VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
    Michail Maniatakos
    Springer International Publishing
    Ebook
    Sofort lieferbar
    This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5 IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhab...
    58,84 €
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  5. Secure, Low-Power IoT Communication Using Edge-Coded Signaling
    Secure, Low-Power IoT Communication Using Edge-Coded Signaling
    Shahzad Muzaffar
    Springer International Publishing
    Ebook
    Sofort lieferbar
    This book discusses single-channel, device-to-device communication in the Internet of Things (IoT) at the signal encoding level and introduces a new family of encoding techniques that result in sig...
    90,94 €
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  6. VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
    VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence
    Ibrahim (Abe) M. Elfadel
    Springer Nature Switzerland
    Ebook
    Sofort lieferbar
    This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5 IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artif...
    85,59 €
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  7. Machine Learning in VLSI Computer-Aided Design
    Machine Learning in VLSI Computer-Aided Design
    Ibrahim (Abe) M. Elfadel
    Springer International Publishing, Springer Nature Switzerland
    Buch
    Bezug 11-15
    This book provides readers with an up-to-date account of the use of machine learning frameworks, methodologies, algorithms and techniques in the context of computer-aided design (CAD) for very-l...
    213,99 €
    Alle Preise inkl. MwSt | Versandkostenfrei
    In den Warenkorb Zum Merkzettel
  8. 3D Stacked Chips
    3D Stacked Chips
    Gerhard Fettweis
    Springer International Publishing, Springer International Publishing
    Buch
    Bezug 11-15
    This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integra...
    53,49 €
    Alle Preise inkl. MwSt | Versandkostenfrei
    In den Warenkorb Zum Merkzettel
  9. The IoT Physical Layer
    The IoT Physical Layer
    Mohammed Ismail
    Springer International Publishing, Springer International Publishing
    Buch
    Bezug 11-15
    This book documents some of the most recent advances on the physical layer of the Internet of Things (IoT), including sensors, circuits, and systems. The application area selected for illustrating ...
    106,99 €
    Alle Preise inkl. MwSt | Versandkostenfrei
    In den Warenkorb Zum Merkzettel
  10. 3D Stacked Chips
    3D Stacked Chips
    Gerhard Fettweis
    Springer International Publishing, Springer International Publishing
    Taschenbuch
    Bezug 11-15
    This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integra...
    53,49 €
    Alle Preise inkl. MwSt | Versandkostenfrei
    In den Warenkorb Zum Merkzettel
  11. The IoT Physical Layer
    The IoT Physical Layer
    Mohammed Ismail
    Springer International Publishing, Springer International Publishing
    Taschenbuch
    Bezug 11-15
    This book documents some of the most recent advances on the physical layer of the Internet of Things (IoT), including sensors, circuits, and systems. The application area selected for illustrati...
    139,09 €
    Alle Preise inkl. MwSt | Versandkostenfrei
    In den Warenkorb Zum Merkzettel
  12. VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
    VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
    Michail Maniatakos
    Springer International Publishing, Springer International Publishing
    Taschenbuch
    Bezug 11-15
    This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5 IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhab...
    58,84 €
    Alle Preise inkl. MwSt | Versandkostenfrei
    In den Warenkorb Zum Merkzettel
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