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  1. Ebook
    Sofort lieferbar
    Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-p...
    149,79 €
    Alle Preise inkl. MwSt
  2. Ebook
    Sofort lieferbar
    This book reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book be...
    89,49 €
    Alle Preise inkl. MwSt
  3. Ebook
    Sofort lieferbar
    This book reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book be...
    89,49 €
    Alle Preise inkl. MwSt
  4. Ebook
    Sofort lieferbar
    Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented ...
    128,99 €
    Alle Preise inkl. MwSt
  5. Ebook
    Sofort lieferbar
    Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented ...
    130,99 €
    Alle Preise inkl. MwSt
  6. Buch
    Bezug 11-15
    Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry's vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and...
    184,13 €
    Alle Preise inkl. MwSt | Versandkostenfrei
  7. Taschenbuch
    Bezug 11-15
    3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers un...
    72,82 €
    Alle Preise inkl. MwSt | Versandkostenfrei
  8. Buch
    Bezug 11-15
    3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers un...
    165,44 €
    Alle Preise inkl. MwSt | Versandkostenfrei
  9. Taschenbuch
    Bezug 16-20
    Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry's vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and...
    184,13 €
    Alle Preise inkl. MwSt | Versandkostenfrei
  10. Taschenbuch
    Bezug 16-20
    Normally the cause of failure, stress concentrations are introduced in laminated plates in the forms of circular holes, elliptical openings and straight cracks. These forms of cutouts have many pra...
    443,30 €
    Alle Preise inkl. MwSt | Versandkostenfrei
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