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  1. Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
    Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
    Cher Ming Tan
    Springer London
    Ebook
    Sofort lieferbar
    Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI inte...
    96,29 €
    Alle Preise inkl. MwSt
    In den Warenkorb Zum Merkzettel
  2. Electromigration Modeling at Circuit Layout Level
    Electromigration Modeling at Circuit Layout Level
    Cher Ming Tan
    Springer Nature Singapore
    Ebook
    Sofort lieferbar
    Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconne...
    53,49 €
    Alle Preise inkl. MwSt
    In den Warenkorb Zum Merkzettel
  3. Future Learning in Primary Schools
    Future Learning in Primary Schools
    Ching Sing Chai
    Springer Nature Singapore
    Ebook
    Sofort lieferbar
    This edited book tells the story of the multifaceted efforts devoted by a 'future school' in Singapore-The Nan Chiau Primary School-in shaping future learning. It documents the various measures imp...
    53,49 €
    Alle Preise inkl. MwSt
    In den Warenkorb Zum Merkzettel
  4. Theory and Practice of Quality and Reliability Engineering in Asia Industry
    Theory and Practice of Quality and Reliability Engineering in Asia Industry
    Cher Ming Tan
    Springer Nature Singapore
    Ebook
    Sofort lieferbar
    This book discusses the application of quality and reliability engineering in Asian industries, and offers information for multinational companies (MNC) looking to transfer some of their operation ...
    213,99 €
    Alle Preise inkl. MwSt
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  5. Graphene and VLSI Interconnects
    Graphene and VLSI Interconnects
    Cher-Ming Tan
    Taylor & Francis eBooks
    Ebook
    Sofort lieferbar
    Copper (Cu) has been used as an interconnection material in the semiconductor industry for years owing to its best balance of conductivity and performance. However, it is running out of steam as it...
    131,99 €
    Alle Preise inkl. MwSt
    In den Warenkorb Zum Merkzettel
  6. Graphene and VLSI Interconnects
    Graphene and VLSI Interconnects
    Cher-Ming Tan
    Taylor & Francis eBooks
    Ebook
    Sofort lieferbar
    Copper (Cu) has been used as an interconnection material in the semiconductor industry for years owing to its best balance of conductivity and performance. However, it is running out of steam as it...
    131,99 €
    Alle Preise inkl. MwSt
    In den Warenkorb Zum Merkzettel
  7. Reliability and Failure Analysis of High-Power LED Packaging
    Reliability and Failure Analysis of High-Power LED Packaging
    Cher Ming Tan
    Elsevier Science & Techn.
    Ebook
    Sofort lieferbar
    Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate ...
    175,00 €
    Alle Preise inkl. MwSt
    In den Warenkorb Zum Merkzettel
  8. Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
    Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
    Cher Ming Tan
    Springer London, Springer London
    Buch
    Bezug 11-15
    Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of...
    125,28 €
    Alle Preise inkl. MwSt | Versandkostenfrei
    In den Warenkorb Zum Merkzettel
  9. Electromigration Modeling at Circuit Layout Level
    Electromigration Modeling at Circuit Layout Level
    Feifei He
    Springer Nature Singapore, Springer Nature Singapore
    Taschenbuch
    Bezug 11-15
    Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconne...
    64,23 €
    Alle Preise inkl. MwSt | Versandkostenfrei
    In den Warenkorb Zum Merkzettel
  10. ELECTROMIGRATION IN ULSI INTERCONNECTI..
    ELECTROMIGRATION IN ULSI INTERCONNECTI..
    Cher Ming Tan
    World Scientific
    Buch
    Bezug 11-15
    Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigrat...
    133,32 €
    Alle Preise inkl. MwSt | Versandkostenfrei
    In den Warenkorb Zum Merkzettel
  11. Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
    Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
    Cher Ming Tan
    Springer London, Springer London
    Taschenbuch
    Bezug 11-15
    Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of...
    125,28 €
    Alle Preise inkl. MwSt | Versandkostenfrei
    In den Warenkorb Zum Merkzettel
  12. Future Learning in Primary Schools
    Future Learning in Primary Schools
    Ching Sing Chai
    Springer Nature Singapore, Springer Nature Singapore
    Buch
    Bezug 11-15
    This edited book tells the story of the multifaceted efforts devoted by a 'future school' in Singapore-The Nan Chiau Primary School-in shaping future learning. It documents the various measures imp...
    64,23 €
    Alle Preise inkl. MwSt | Versandkostenfrei
    In den Warenkorb Zum Merkzettel
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