brandon noia

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  1. Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
    Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
    Brandon Noia
    Springer International Publishing
    Ebook
    Sofort lieferbar
    This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects.  The authors ident...
    96,29 €
    Alle Preise inkl. MwSt
    In den Warenkorb Zum Merkzettel
  2. Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
    Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
    Krishnendu Chakrabarty
    Springer International Publishing, Springer International Publishing
    Buch
    Bezug 11-15
    This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identi...
    106,99 €
    Alle Preise inkl. MwSt | Versandkostenfrei
    In den Warenkorb Zum Merkzettel
  3. Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
    Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
    Krishnendu Chakrabarty
    Springer International Publishing, Springer International Publishing
    Taschenbuch
    Print on Demand
    This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identi...
    109,99 €
    Alle Preise inkl. MwSt | Versandkostenfrei
    In den Warenkorb Zum Merkzettel
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