Microjoining and Nanojoining
-5 %

Microjoining and Nanojoining

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Besorgungstitel | Lieferzeit:3-5 Tage I

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ISBN-13:
9781845691790
Einband:
Buch
Erscheinungsdatum:
01.04.2008
Seiten:
832
Autor:
Y. N. Zhou
Gewicht:
1329 g
Format:
241x166x54 mm
Serie:
Series in Welding and Other Jo
Sprache:
Englisch
Beschreibung:

Part 1 Basics of microjoining: Mechanisms of solid-state bonding; Mechanisms of soldering and brazing; Mechanisms of fusion microwelding; Modelling of solid-state bonding; Modelling of fusion microwelding; Sensing, monitoring and control; Assembly process automation and materials handling. Part 2 Microjoining and nanojoining processes: Microelectronics wire bonding; Solid-state diffusion bonding; Bonding using nanoparticles; Diffusion soldering and brazing; Laser soldering; Fluxless soldering; Laser microwelding; Electron beam microwelding; Resistance microwelding; Adhesive bonding; Introduction to nanojoining. Part 3 Microjoining of materials and applications of microjoining: Joining of high temperature superconductors; Joining of shape memory alloys; Wafer bonding; Plastics microwelding; Microjoining in medical components and devices; Hermetic sealing of solid oxide fuel cells; Joining of bulk nanostructured materials; Ceramic/metal bonding.
The first part of the book reviews the basics of microjoining and part two covers microjoining processes. A third group of chapters discusses microjoining of materials and a final group of chapters analyses the applications of microjoining.